Simulation of electromigration effects on voids in monocrystalline Ag films
In: Physical Review B: Condensed matter and materials physics, Jg. 85 (2012) ; Nr. 3, S. 035449 (8 pages)
ISSN: 1098-0121, 1550-235X
Zeitschriftenaufsatz / Fach: Physik
Fakultät für Physik » Experimentalphysik
We developed a three-dimensional, atomistic model based on the kinetic Monte Carlo method to investigate how voids penetrating a monocrystalline silver film are affected by electromigration. The simulations show a clear dependency between the nonequilibrium shape of the voids and the crystallographic orientation of the film. The simulation results are in accordance with experimental results on bicrystalline silver wires.