Modeling of spurious coupling between modes in metal packages and embedded circuits

In: IEEE MTT-S International Microwave Symposium, 2007 : 3 - 8 June 2007, [Honolulu, HI] / Microwave Theory and Techniques Society (Hrsg.)
Session THP1A-03, Piscataway, NJ: IEEE Service Center (2007), S. 1927 - 1930
ISBN: 978-1-4244-2645-4, 978-1-4244-2646-1
Buchaufsatz / Kapitel / Fach: Elektrotechnik
Fakultät für Ingenieurwissenschaften » Elektrotechnik und Informationstechnik » Hochfrequenztechnik
The consideration of electromagnetic interaction between spurious modes in metal packages and its enclosed microwave circuit (MMIC) in a circuit simulator is an important topic in circuit design. In this paper a novel method is described to determine mutual coupling networks for incorporation of this parasitic coupling into a SPICE based circuit simulator. For simple package shapes the coupling networks can be determined analytically, whereas full-wave simulations are needed for more complex ones. To shorten the duration, time-domain simulators need for analyzing a high-Q structure, Prony’s method is applied to extract circuit parameters from short time sequences.<br>
Weitere Ausgaben: 1-4244-0687-0 (Printausgabe)

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